Beijing (ZXZC)- Automotive semiconductor supplier Infineon on May 6 announced that it reached an agreement with Xiaomi EV to supply advanced power semiconductors to the carmaker by 2027. 

Photo credit: Xiaomi EV

According to Infineon, it will provide Xiaomi EV with silicon carbide chips, modules, and various crucial microcontroller chips. Specifically, Infineon will supply two 1,200V HybridPACK Drive G2 CoolSiC modules for Xiaomi's SU7 Max version all-electric sedan.

Infineon added its CoolSiC power modules can operate at higher temperatures, ensuring top-notch performance, driving power, and longevity. For instance, traction inverters based on this technology can further increase the driving range of electric vehicles.

On the other hand, HybridPACK Drive is Infineon's leading series of power modules for electric vehicles, with nearly 8.5 million units shipped since 2017.

Aside from the abovementioned products, Infineon will also supply Xiaomi EV with various other products tailored to different needs, such as EiceDRIVER™ gate drivers and over ten microcontrollers for different applications.

Additionally, the two companies have also agreed to further cooperate in the SiC automotive application field to fully leverage the advantages of Infineon's silicon carbide product portfolio.