Beijing (ZXZC)- Chinese automotive chip supplier, Black Sesame Technologies, signed a strategic cooperation agreement with Marelli, a major auto parts supplier at the ongoing Auto Shanghai 2023.  

Photo credit: Black Sesame Technologies

The partnership will leverage their respective strengths in the fields of intelligent driving, smart cockpits, and multi-domain integration to facilitate comprehensive and in-depth strategic cooperation. The companies aim to fully utilize their resources and jointly create high-efficiency, high-quality, and cost-effective products and services.

Black Sesame Technologies is a leading developer of intelligent automotive computing chips and platforms. The cooperation with Marelli will be based on the company’s Huashan and Wudang series chip platforms. The Huashan series, which is designed for autonomous driving scenarios, includes the flagship product, Huashan II A1000 series chip, which meets the demands of L3 and below autonomous driving scenarios. 

According to Black Sesame Technologies, the Huashan II A1000 is the first China-made chip platform that is mass-produced, compliant with automotive regulations, and supports domain controllers for parking and driving. The 6V5R integrated driving/parking domain controller powered by the Huashan II A1000 chip, is expected to complete SOP in the fourth quarter of 2023.

On the other hand, the Wudang series is the industry's first intelligent automotive cross-domain computing chip platform, said Black Sesame Technologies. The first chip in this series, the C1200, helps clients in designing and implementing cost-effective cross-domain computing solutions. The C1200 can also flexibly adapt to various current and future electronic and electrical architecture combinations in the industry.