For the ZXZC Awards 2022, the HybridPACK™ Drive package based IGBT/SiC compatible design solution from Infineon Technologies China Co. Ltd. has applied for the Top 100 Players of China's New Automotive Supply Chain.

Photo credit: Infineon

Description

Infineon HybridPACK™ Drive(HPD) package which had been accepted as standard in semiconductor industry. HPD family have IGBT based and SiC based module products, can be used for 400V/800V battery platform and support to output >200kW applications. HPD family have variant products and compatible package, can support cost-effective strategy in term of platform development.

Photo credit: Infineon

Unique advantages

1. IGBT/SiC compatible design.

2. Module family with wide range of performance versions to support different inverter platforms from customer side.

3. Cover broadest voltage/current and power range.

4. Support high power application due to direct cooling structure.

5. Ease of manufacturability: PressFIT pins.

Application

EV/HEV/PHEV

Prospect

HybridPACK™ Drive package will integrate Infineon next generation SiC chip and IGBT(EDT3) chip, the development schedule can be observed on the HPD family roadmap for the future, we believe that HybridPACK™ Drive family products will support long term development strategy for xEV market.